In electronic packaging, the reliability of solders is a critical issue, since serve as both electrical and mechanical connections. The most common failures arise from the thermo-mechanical fatigue (TMF) of solders, due to mismatches in the coefficient of thermal expansion between the Si-chip and the printed circuit board. In order to meet the demands of miniaturization and enhanced performance in severe environments, a novel adaptive Tin-Silver-Copper (SnAgCu) solder reinforced with NiTi shape-memory alloy (particles or fiber) developed. An experimental apparatus has been designed to investigate the thermo-mechanical strain-controlled fatigue life of the solder during both single and multiple thermal cycling under double-shear loading. For comparison, thermo-mechanical single shear tests were also performed in monolithic Tin-Silver-Copper solder and in solder reinforced with Cu fiber. Also, micro-structural evaluation of the solders during the 5th cycle was possible using Scanning and Optical microcopy together with EDS analysis.